Caractéristiques et avantages
- Reduces CPU temperatures by 3 to 12 degrees Celsius compared to standard compounds.
- Contains 99.9% pure silver for superior thermal conductivity.
- Non-electrically conductive for safer application around components.
- Comes in a 3.5-gram syringe, covering numerous CPU cores.
- Engineered for long-term stability and performance enhancement.
- Easy application with controlled viscosity for perfect fitting.